cExpress-SL-i5-6300U

ADLINK Technology
976-CEXP-SL-I5-6300U
cExpress-SL-i5-6300U

Mfr.:

Paglalarawan:
Computer-On-Modules - COM cExpress-SL-i5-6300UCompact COM Express Type 6 module with Intel i5-6300U with GT2 level graphics

Datasheet:
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Availability

Stock:
Hindi Naka-stock
Lead-Time ng Pabrika:
30 (na) Linggo Tinatayang oras ng paggawa sa pabrika.
Matagal na lead time na iniulat sa produktong ito.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
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Ext. Presyo:
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Est. Taripa:
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Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱58,968.37 ₱58,968.37
₱55,527.68 ₱555,276.80

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
ADLINK Technology
Kategorya ng Produkto: Mga Computer-On-Module - COM
RoHS:  
COM Express Compact Type 6
Brand: ADLINK Technology
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: TW
Uri ng Produkto: Computer-On-Modules - COM
Series: cExpress-SL
Dami ng Pack ng Pabrika: 1
Subcategory: Computing
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Datasheet

PCN

Express-SL/SLE COM

ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.

COM Express Modules

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principle for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.

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