ATS012012011-SF-2J

Advanced Thermal Solutions
984-ATS012012011SF2J
ATS012012011-SF-2J

Mfr.:

Paglalarawan:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 12x12x11mm

Datasheet:
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May Stock: 79

Stock:
79 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
8 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱245.34 ₱245.34
₱230.26 ₱2,302.60
₱223.88 ₱4,477.60
₱211.70 ₱10,585.00
₱198.94 ₱19,894.00
₱186.76 ₱37,352.00
₱180.38 ₱90,190.00
₱169.94 ₱169,940.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
21.39 C/W
12 mm
12 mm
11 mm
Brand: Advanced Thermal Solutions
Kulay: Black
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: US
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: BGA High Aspect Ratio
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: Value-Line Platform
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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