ATS020020025-SF-7X

Advanced Thermal Solutions
984-ATS020020025SF7X
ATS020020025-SF-7X

Mfr.:

Paglalarawan:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 20x20x25mm

Datasheet:
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May Stock: 64

Stock:
64
Maaaring Ipadala Agad
Inoorder:
98
Lead-Time ng Pabrika:
8
(na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱489.52 ₱489.52
₱464.00 ₱4,640.00
₱437.90 ₱8,758.00
₱412.38 ₱20,619.00
₱386.28 ₱38,628.00
₱363.66 ₱72,732.00
₱350.32 ₱175,160.00
₱337.56 ₱337,560.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
4.87 C/W
20 mm
20 mm
25 mm
Brand: Advanced Thermal Solutions
Kulay: Black
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: US
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: BGA High Aspect Ratio
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: Value-Line Platform
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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