ATS031031007-PF-10F

Advanced Thermal Solutions
984-AT031031007PF10F
ATS031031007-PF-10F

Mfr.:

Paglalarawan:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Cross Cut, No TIM, 31x31x7mm

Datasheet:
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May Stock: 74

Stock:
74 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
8 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱433.84 ₱433.84
₱410.06 ₱4,100.60
₱386.86 ₱7,737.20
₱364.24 ₱18,212.00
₱341.62 ₱34,162.00
₱321.90 ₱64,380.00
₱310.30 ₱155,150.00
₱299.28 ₱299,280.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Omnidirectional Fin
12.23 C/W
31 mm
31 mm
7 mm
Brand: Advanced Thermal Solutions
Kulay: Black
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: CN
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: BGA High Aspect Ratio
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: Value-Line Platform
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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