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ATS035035008-SF-11G

Name: Advanced Thermal Solutions ATS035035008-SF-11G
Brand: Advanced Thermal Solutions
SKU: 984-AT035035008SF11G
Price: 352.06 PHP
Availability: InStock

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Mouser #:

984-AT035035008SF11G

Mfr. #:

ATS035035008-SF-11G

Mfr.:

Advanced Thermal Solutions

Paglalarawan:

Heat Sinks BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 35x35x8mm (LxWxH)

Datasheet:

ATS035035008-SF-11G Datasheet (PDF)

ECAD Model:

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Availability

Stock:: May nangyaring di-inaasahang error. Subukan ulit mamaya.

29 Maaaring Ipadala sa loob ng 10 (na) Araw

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱352.06	₱352.06
	₱328.86	₱3,288.60
	₱310.30	₱6,206.00
	₱292.32	₱14,616.00
	₱275.50	₱27,550.00
	₱259.84	₱51,968.00
	₱252.88	₱126,440.00
	₱243.60	₱243,600.00

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Advanced Thermal Solutions
Kategorya ng Produkto:	Mga Heat Sink
RoHS:
Produkto:	Heat Sinks
Dinesenyo para sa:	BGA
Isitilo ng Mounting:	PCB
Materyal ng Heatsink:	Aluminum
Istilo ng Fin:	Straight Fin
Thermal Resistance:	11.29 C/W
Haba:	35 mm
Lapad:	35 mm
Taas:	8 mm
Brand:	Advanced Thermal Solutions
Kulay:	Black
Bansa ng Pag-assemble:	Not Available
Bansa ng Diffusion:	Not Available
Bansang Pinagmulan:	CN
Packaging:	Bulk
Uri ng Produkto:	Heat Sinks
Series:	BGA High Aspect Ratio
Dami ng Pack ng Pabrika:	100
Subcategory:	Heat Sinks
Pangalang pangkalakal:	Value-Line Platform
Uri:	Component

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Datasheet

ATS035035008-SF-11G Datasheet (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.