C0805X154K1RACTU

KEMET
80-C0805X154K1R
C0805X154K1RACTU

Mfr.:

Paglalarawan:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V 0.15uF X7R 0805 10% Flex Soft

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

May Stock: 21,179

Stock:
21,179 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
27 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
Packaging:
Buo Reel (Mag-order sa multiple ng 2500)

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
Cut Tape / MouseReel™
₱35.38 ₱35.38
₱17.17 ₱171.70
₱15.49 ₱1,549.00
₱12.64 ₱6,320.00
₱11.72 ₱11,720.00
Buo Reel (Mag-order sa multiple ng 2500)
₱10.73 ₱26,825.00
₱10.15 ₱50,750.00
† ₱350.00 Idaragdag at kakalkulahin sa iyong shopping cart ang bayarin sa MouseReel™ Hindi makakansela at maisasauli ang mga order na MouseReel™

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
KEMET
Kategorya ng Produkto: Mga Multilayer Ceramic Capacitor MLCC - SMD/SMT
RoHS:  
0.15 uF
100 VDC
X7R
10 %
0805
2012
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
2 mm (0.079 in)
1.25 mm (0.049 in)
1.25 mm (0.049 in)
General Type MLCCs
SMD Comm X7R Flex
Reel
Cut Tape
MouseReel
Brand: KEMET
Klase: Class 2
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: MX
Package / Case: 0805 (2012 metric)
Uri ng Produkto: Ceramic Capacitors
Dami ng Pack ng Pabrika: 2500
Subcategory: Capacitors
Pangalang pangkalakal: FT-CAP
Uri: Surface Mount Multilayer Ceramic Chip Capacitor
Mga Alias ng # ng Piyesa : C0805X154K1RAC7800
Timbang ng Unit: 5.500 mg
Nahanap na mga produkto:
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Pumili ng kahit isang checkbox sa itaas para magpakita ng katulad na produkto sa kategoryang ito.
Mga Piniling Attribute: 0

CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
TARIC:
8532240000
MXHTS:
8532240400
BRHTS:
85322410
ECCN:
EAR99

Group Power Conversion Components

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy. 

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount Multilayer Ceramic Chip Capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. The Flexible termination directs circuit board stress away from the ceramic body and into the termination area. These MLCCs reduce the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.