LE87100NQC

Microchip Technology
579-LE87100NQC
LE87100NQC

Mfr.:

Paglalarawan:
Buffers & Line Drivers 1CH 100MHz Line Driver

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

Availability

Stock:
Hindi Naka-stock
Lead-Time ng Pabrika:
Minimum: 2450   Mga Multiple: 2450
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱93.96 ₱230,202.00

Alternatibong Packaging

Mfr. # ng Piyesa:
Packaging:
Reel, Cut Tape
Availability:
May Stock
Presyo:
₱128.76
Min:
1

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Microchip
Kategorya ng Produkto: Mga Buffer at Line Driver
RoHS:  
2 Input
2 Output
Non-Inverting
1.2 mA
- 6.6 V
13.2 V
32 mA
- 40 C
+ 85 C
SMD/SMT
Tray
Brand: Microchip Technology
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: MY
Maselan sa Moisture: Yes
Uri ng Produkto: Buffers & Line Drivers
Dami ng Pack ng Pabrika: 2450
Subcategory: Logic ICs
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Mga Piniling Attribute: 0

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CNHTS:
8542399000
USHTS:
8542390090
TARIC:
8542399000
ECCN:
EAR99

Le87100 Single-Channel Differential Amplifier

Microsemi / Microchip Le87100 Single-Channel Differential Amplifier is designed to drive PLC high-power signals. The Le87100 device contains a pair of wide-band amplifiers designed for a high-power output with low-power consumption. Line driver gain is set externally to the device. A single high-voltage supply or dual supplies can power the device. Le87100 can be programmed to one of three preset bias levels to optimize power and performance. Also, the line driver features a power down state, which forces low-power and high-impedance mode for receive transmissions or idle operations. The control pins respond to input levels that can be generated with a standard GPIO but are tolerant of higher voltage logic levels. The Microsemi / Microchip Le87100 device is available in a 16-pin (4mm x 4mm) QFN package with an exposed pad for enhanced thermal conductivity.