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171565-3003

Name: Molex 171565-3003
Brand: Molex
SKU: 538-171565-3003
Price: 8566.6 PHP
Availability: OutOfStock

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Mouser #:

538-171565-3003

Mfr. #:

171565-3003

Mfr.:

Molex

Paglalarawan:

I/O Connectors zQSFP+ Stkd 2x3 Conn wElastomeric LP DU

Datasheet:

171565-3003 Datasheet

ECAD Model:

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Higit Pang Impormasyon

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Availability

Stock:: Hindi Naka-stock

May nangyaring di-inaasahang error. Subukan ulit mamaya.
Lead-Time ng Pabrika:: Humiling ng Quote sa Paghahatid

Ipasok ang Dami:

Minimum: 24 Mga Multiple: 24

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱8,566.60	₱205,598.40
	₱8,280.66	₱397,471.68
120	Quote

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Molex
Kategorya ng Produkto:	Mga I/O Connector
RoHS:
REACH - SVHC:
Produkto:	SFP Connectors
Gender:	Female
Dami ng Posisyon:	228 Position
Pitch:	0.8 mm
Rating ng Voltage:	30 V
Plating ng Contact:	Gold
Isitilo ng Mounting:	PCB Mount
Istilo ng Termination:	Through Hole
Anggulo ng Mounting:	Right Angle
Series:	171565
Minimum na Operating Temperature:	- 40 C
Maximum na Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Molex
Kulay:	Black
Materyal ng Contact:	Copper Alloy
Bansa ng Pag-assemble:	Not Available
Bansa ng Diffusion:	Not Available
Bansang Pinagmulan:	CN
Rating ng Current:	500 mA
Rating ng Flammability:	UL 94 V-0
Materyal ng Housing:	Thermoplastic (TP)
Dami ng Port:	6 Port
Uri ng Produkto:	I/O Connectors
Dami ng Pack ng Pabrika:	24
Subcategory:	I/O Connectors
Pangalang pangkalakal:	zQSFP+
Uri:	zQSFP
Timbang ng Unit:	96.028 g

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Datasheet

171565-3003 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zQSFP+ EMI Cages

Molex zQSFP+ EMI Cages are designed with an advanced heat-sink system to provide a high level of heat dissipation for next-generation system power levels. The die-cast design features a screw-down option to the PCB for maximum board retention. The spring-finger design provides optimal EMI grounding and allows for more space to route high-speed traces.

zQSFP+ I/O Connectors

Molex zQSFP+ interconnect solution conforms to SFF-8665 QSFP28 and is designed for high-density interconnect applications. Components of the system include SMT connectors and stacked integrated 2-by-1, 2-by-2, and 2-by-3 connectors and cages. Molex zQSFP+ SMT connectors support 100Gbps Ethernet and 100Gbps InfiniBand (IB) Enhanced Data Rate (EDR) applications.