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HDTM-6-08-1-S-VT-0-2

Name: Samtec HDTM-6-08-1-S-VT-0-2
Brand: Samtec
SKU: 200-HDTM-6081SVT02
Price: 970.34 PHP
Availability: OutOfStock

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Mouser #:

200-HDTM-6081SVT02

Mfr. #:

HDTM-6-08-1-S-VT-0-2

Mfr.:

Samtec

Paglalarawan:

High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-6-08-1-S-VT-0-2 Datasheet (PDF)

ECAD Model:

I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

Higit Pang Impormasyon

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Availability

Stock:: Hindi Naka-stock

May nangyaring di-inaasahang error. Subukan ulit mamaya.
Lead-Time ng Pabrika:: 12 (na) Linggo Tinatayang oras ng paggawa sa pabrika.

Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱970.34	₱970.34
	₱874.64	₱8,746.40
	₱779.52	₱19,488.00
	₱636.26	₱57,263.40
	₱502.28	₱135,615.60
	₱436.16	₱235,526.40
	₱369.46	₱382,391.10

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Samtec
Kategorya ng Produkto:	Mga High Speed / Modular Connector
RoHS:
Produkto:	Headers
Dami ng Row:	8 Row
Pitch:	1.8 mm
Istilo ng Termination:	Solder Pin
Plating ng Contact:	Gold
Series:	HDTM
Packaging:	Tray
Brand:	Samtec
Materyal ng Contact:	Copper Alloy
Bansa ng Pag-assemble:	Not Available
Bansa ng Diffusion:	Not Available
Bansang Pinagmulan:	CN
Kulay ng Housing:	Black
Materyal ng Housing:	Liquid Crystal Polymer (LCP)
Maximum na Operating Temperature:	+ 105 C
Minimum na Operating Temperature:	- 40 C
Anggulo ng Mounting:	Vertical
Uri ng Produkto:	High Speed / Modular Connectors
Dami ng Pack ng Pabrika:	45
Subcategory:	Backplane Connectors
Pangalang pangkalakal:	XCede

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Mga Piniling Attribute: 0

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Datasheet

HDTM-6-08-1-S-VT-0-2 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.