CC3301ENJARSBR

Texas Instruments
595-CC3301ENJARSBR
CC3301ENJARSBR

Mfr.:

Paglalarawan:
RF Microcontrollers - MCU SimpleLink Wi-Fi 6 a nd Bluetooth Low En

Datasheet:
ECAD Model:
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Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Texas Instruments
Kategorya ng Produkto: Mga RF Microcontroller - MCU
Restriksyon sa Paghahatid:
 Kasalukuyang hindi ibinebenta ng Mouser ang produktong ito sa inyong rehiyon.
RoHS:  
Brand: Texas Instruments
Bansa ng Pag-assemble: CN
Bansa ng Diffusion: TW
Bansang Pinagmulan: CN
Maselan sa Moisture: Yes
Uri ng Produkto: RF Microcontrollers - MCU
Series: CC3301
Dami ng Pack ng Pabrika: 3000
Subcategory: Wireless & RF Integrated Circuits
Teknolohiya: Si
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Mga Piniling Attribute: 0

Datasheet

PCN

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CNHTS:
8542391090
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
5A992.C

Processors

Texas Instruments Processors provide a comprehensive portfolio, proven software, and worldwide support, enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance, and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

CC3300 & CC3301 SimpleLink™ Transceivers

Texas Instruments CC3300 and CC3301 SimpleLink™ Transceivers are highly integrated single-chip WLAN and BLUETOOTH® Low Energy devices available in a 40-pin, 5mm x 5mm QFN package with 0.4mm pitch for easy design integration. These 10th-generation connectivity combo chips are based upon proven technology and complement the TI integrated devices for connectivity portfolio. The modules are ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50Mbps maximum at the IP layer. TI CC3300 and CC3301 SimpleLink Transceivers bring the efficiency of Wi-Fi® 6 to embedded device applications with a small PCB footprint and an optimized bill of materials (BOM). Applications include grid infrastructure, building and home automation, retail automation and payment, medical, and appliances.

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