5583S-05

3M Electronic Specialty
517-5583S-05
5583S-05

Mfr.:

Paglalarawan:
Thermal Interface Products Thermally Conductive Interface Pad 210mm x 300mm X .5mm Silicone Polymer

ECAD Model:
I-download ang libreng Library Loader para i-convert ang file na ito para sa iyong ECAD Tool. Matuto nang higit pa tungkol sa ECAD Model.

May Stock: 372

Stock:
372 Maaaring Ipadala Agad
Lead-Time ng Pabrika:
10 (na) Linggo Tinatayang oras ng paggawa sa pabrika para sa mga bilang na mas marami kaysa ipinakita.
Minimum: 1   Mga Multiple: 1
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱1,339.80 ₱1,339.80
₱1,186.10 ₱11,861.00
₱1,129.26 ₱28,231.50
₱1,044.58 ₱83,566.40
₱1,023.70 ₱245,688.00
₱1,012.68 ₱567,100.80

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
3M
Kategorya ng Produkto: Mga Produkto na Thermal Interface
Gap Fillers / Gap Pads / Sheets
Thermally Conductive Tape
Non-standard
Silicone Elastomer
1 W/m-K
White
- 40 C
+ 125 C
300 mm
210 mm
0.5 mm
UL 94 V-0
5583S
Brand: 3M Electronic Specialty
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: KR
Uri ng Produkto: Thermal Interface Products
Dami ng Pack ng Pabrika: 80
Subcategory: Thermal Management
Mga Alias ng # ng Piyesa : 5583S 00051131288980 7010405242
Timbang ng Unit: 55.238 g
Nahanap na mga produkto:
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Pumili ng kahit isang checkbox sa itaas para magpakita ng katulad na produkto sa kategoryang ito.
Mga Piniling Attribute: 0

CNHTS:
3824999999
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.