ATS-59000-C1-R0

Advanced Thermal Solutions
984-ATS-59000-C1-R0
ATS-59000-C1-R0

Mfr.:

Paglalarawan:
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 21x45x9mm

Datasheet:
ECAD Model:
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Availability

Stock:
Hindi Naka-stock
Lead-Time ng Pabrika:
8 (na) Linggo Tinatayang oras ng paggawa sa pabrika.
Minimum: 100   Mga Multiple: 100
Presyo ng Unit:
₱-.--
Ext. Presyo:
₱-.--
Est. Taripa:
LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami Presyo ng Unit
Ext. Presyo
₱2,024.20 ₱202,420.00
₱1,927.92 ₱385,584.00

Katangian ng Produkto Value ng Attribute Pumili ng Attribute
Advanced Thermal Solutions
Kategorya ng Produkto: Mga Heat Sink
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
6.1 C/W
45 mm
21 mm
9 mm
Brand: Advanced Thermal Solutions
Kulay: Black
Bansa ng Pag-assemble: Not Available
Bansa ng Diffusion: Not Available
Bansang Pinagmulan: CN
Packaging: Bulk
Uri ng Produkto: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Dami ng Pack ng Pabrika: 100
Subcategory: Heat Sinks
Pangalang pangkalakal: maxiFLOW maxiGRIP
Uri: Component
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Mga Piniling Attribute: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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