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TD190N16SOFHPSA2

Name: Infineon TD190N16SOFHPSA2
Brand: Infineon Technologies
SKU: 726-TD190N16SOFHPSA2
Price: 3038.04 PHP
Availability: InStock

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Mouser #:

726-TD190N16SOFHPSA2

Mfr. #:

TD190N16SOFHPSA2

Mfr.:

Infineon Technologies

Paglalarawan:

Discrete Semiconductor Modules L#T-BOND MODULE

Datasheet:

TD190N16SOFHPSA2 Datasheet (PDF)

ECAD Model:

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May Stock: 16

Stock:: 16

Maaaring Ipadala Agad

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Inoorder:: 4
Lead-Time ng Pabrika:: 24

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Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

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Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱3,038.04	₱3,038.04
	₱2,275.34	₱18,202.72
	₱2,190.08	₱227,768.32

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Infineon
Kategorya ng Produkto:	Mga Module ng Discrete Semiconductor
RoHS:
Produkto:	Thyristor-Diode Modules
Uri:	Phase Control
Teknolohiya:	Si
Vr - Reverse Voltage:	1.6 kV
Isitilo ng Mounting:	Screw Mount
Package / Case:	PB34
Minimum na Operating Temperature:	- 40 C
Maximum na Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Kumpigurasyon:	SCR/Diode Phase Control
Bansa ng Pag-assemble:	Not Available
Bansa ng Diffusion:	DE
Bansang Pinagmulan:	DE
Gate Trigger Current - Igt:	145 mA
Holding Current Ih Max:	200 mA
Id - Continuous Drain Current:	30 mA
Uri ng Produkto:	Discrete Semiconductor Modules
Dami ng Pack ng Pabrika:	8
Subcategory:	Discrete and Power Modules
Karaniwang Tagal ng Delay:	2 us
Karaniwang Tagal ng Delay ng Pag-off:	320 us
Mga Alias ng # ng Piyesa :	TD190N16SOF SP001206284
Timbang ng Unit:	165 g

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Datasheet

TD190N16SOFHPSA2 Datasheet (PDF)

Application Notes

Product Catalogs

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CNHTS:: 8504901900
USHTS:: 8541300080
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.