200-LPAF Mga Board to Board at Mezzanine Connector

Mga Resulta: 114
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dami ng Posisyon Pitch Dami ng Row Istilo ng Termination Anggulo ng Mounting Taas ng Stack Rating ng Current Rating ng Voltage Maximum na Bilis ng Data Minimum na Operating Temperature Maximum na Operating Temperature Plating ng Contact Materyal ng Contact Materyal ng Housing Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 550
Mult.: 550
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 550
Mult.: 550
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 325
Mult.: 325
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
: 500
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 650
Mult.: 650
: 650
Hindi
LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 1
Mult.: 1
: 550
Hindi
LPAF Reel, Cut Tape
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 350
Mult.: 350
: 350

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 500
Mult.: 500
: 500

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 500
Mult.: 500
: 500

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 550
Mult.: 550
: 550

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 350
Mult.: 350
: 350

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 6 (na) Linggo
Min.: 425
Mult.: 425
: 425
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 425
Mult.: 425
: 425
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 350
Mult.: 350
: 350
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 500
Mult.: 500
: 500
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 500
Mult.: 500
: 500
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 500
Mult.: 500
: 500
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 500
Mult.: 500
: 500
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 325
Mult.: 325
: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 7 (na) Linggo
Min.: 500
Mult.: 500
: 500
Reel
Samtec LPAF-40-03.0-S-04-1-K-TR
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 4 (na) Linggo
Min.: 550
Mult.: 550
: 550
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 500
Mult.: 500
: 500
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 5 (na) Linggo
Min.: 325
Mult.: 325
: 325
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 11 (na) Linggo
Min.: 350
Mult.: 350
: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 550
Mult.: 550
: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel