EDAC Mga Board to Board at Mezzanine Connector

Mga Resulta: 4
Pumili Larawan # ng Piyesa
 Mfr.
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Dami RoHS ECAD Model Produkto
Dami ng Posisyon
Pitch
Dami ng Row
Istilo ng Termination
Anggulo ng Mounting
Rating ng Current
Rating ng Voltage
Minimum na Operating Temperature
Maximum na Operating Temperature
Plating ng Contact
Materyal ng Contact
Materyal ng Housing
Series
EDAC Board to Board & Mezzanine Connectors B2B- 100 Conts, Vert SMT, M, 19Gbps @-3dB
Datasheet
Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 1,400
Mult.: 1,400

Headers 100 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 472
EDAC Board to Board & Mezzanine Connectors B2B- 150 Conts, Vert SMT, M, 19Gbps @-3dB
Datasheet
Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 1,050
Mult.: 1

Headers 150 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 472
EDAC Board to Board & Mezzanine Connectors B2B- 100 Conts, R/A SMT, F, 19Gbps @-3dB
Datasheet
Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 1,200
Mult.: 1

Headers 100 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle Gold Copper Alloy Liquid Crystal Polymer (LCP) 473
EDAC Board to Board & Mezzanine Connectors B2B- 150 Conts, R/A SMT, F, 19Gbps @-3dB
Datasheet
Lead-Time para sa Hindi Naka-stock 9 (na) Linggo
Min.: 750
Mult.: 1

Headers 150 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 50 V - 55 C + 85 C Gold Copper Alloy Liquid Crystal Polymer (LCP) 473