Tputty 502 Serye Mga Produkto na Thermal Interface

Mga Resulta: 36
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Uri Materyal Thermal Conductivity Breakdown Voltage Kulay Minimum na Operating Temperature Maximum na Operating Temperature Haba Lapad Kapal Tensile Strength Rating ng Flammability Series Packaging
Laird Technologies Thermal Interface Products Tputty 502 40 FG2 9x9" 3W/mK XSoft 19May Stock
16Inoorder
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Boron Nitride 3 W/m-K 4 kVAC White - 45 C + 200 C 229 mm 229 mm 0.04 in UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 60 FG2 9x9" 3W/mK XSoft 22May Stock
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 1.52 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products T PUTTY 502 SILICONE CN02572-8 100CC 7May Stock
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Pad Boron Nitride 3 W/m-K White - 45 C + 200 C 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 80 FG2 9x9" 3W/mK XSoft
1Inoorder
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 0.08 in UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502-020 FG2 9" x 9" sheet
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K 2 kVAC White - 45 C + 200 C 229 mm 229 mm 0.51 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 500cc bulk
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Boron Nitride White - 45 C + 200 C Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 40 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 4 kVAC White - 45 C + 200 C 1.02 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 50 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 8
Mult.: 1

Thermally Conductive Adhesives Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 1.27 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 50 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 60 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 457 mm 457 mm 2.03 mm UL 94 HB Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 70 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 5
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K White - 45 C + 200 C 0.5 mm to 5 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 70 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 457 mm 457 mm 1.778 mm UL 94 HB Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 80 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 90 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 90 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Thermally Conductive Adhesives Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 2.28 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502,FG2,100 9" x 9" Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 2.54 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502,FG2,110 9" x 9" Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Boron Nitride 3 W/m-K White - 45 C + 200 C 229 mm 229 mm 2.79 mm 10 psi UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 FG2 120 9" x 9" Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm 0.12 in UL 94 V-0 Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 130 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 140 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 150 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 160 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Thermally Conductive Adhesives Boron Nitride 3 W/m-K 5 kVAC White - 45 C + 200 C 229 mm 229 mm Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 170 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 180 FG2 9x9" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets 3 W/m-K Tputty 502 Bulk
Laird Technologies Thermal Interface Products Tputty 502 180 FG2 18x18" 3W/mK XSoft Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Tputty 502 Bulk