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GP3000S30-0.060-02-0816

Name: Bergquist Company GP3000S30-0.060-02-0816
Brand: Bergquist Company
SKU: 951-GP3000S30-06002
Price: 7660.06 PHP
Availability: InStock

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Mouser #:

951-GP3000S30-06002

Mfr. #:

GP3000S30-0.060-02-0816

Mfr.:

Bergquist Company

Paglalarawan:

Thermal Interface Products GAP PAD, Conductive, Soft, 8"x16" Sheet, 0.060" Thickness, TGP3000/3000S30

Datasheet:

GP3000S30-0.060-02-0816 Datasheet (PDF)

ECAD Model:

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May Stock: 97

Stock:: 97

Maaaring Ipadala Agad

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Inoorder:: 100
Lead-Time ng Pabrika:: 5

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Ipasok ang Dami:

Minimum: 1 Mga Multiple: 1

Presyo ng Unit:

₱-.--

Ext. Presyo:

₱-.--

Est. Taripa:

LIBRENG Ipapadala ang Produktong Ito

Presyo (PHP)

Dami	Presyo ng Unit	Ext. Presyo
	₱7,660.06	₱7,660.06
	₱6,882.86	₱68,828.60
	₱6,454.82	₱161,370.50
	₱6,222.82	₱311,141.00
	₱6,221.08	₱622,108.00
250	Quote

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Katangian ng Produkto	Value ng Attribute	Pumili ng Attribute
Manufacturer:	Bergquist Company
Kategorya ng Produkto:	Mga Produkto na Thermal Interface
RoHS:
Produkto:	Gap Fillers / Gap Pads / Sheets
Uri:	Thermal Pad
Package / Case:	Non-standard
Materyal:	Silicone Elastomer
Thermal Conductivity:	3 W/m-K
Breakdown Voltage:	3 kVAC
Kulay:	Light Blue
Minimum na Operating Temperature:	- 60 C
Maximum na Operating Temperature:	+ 200 C
Haba:	406.4 mm
Lapad:	203.2 mm
Kapal:	1.524 mm
Tensile Strength:	26 psi
Rating ng Flammability:	UL 94 V-0
Series:	3000S30 / TGP 3000
Brand:	Bergquist Company
Bansa ng Pag-assemble:	Not Available
Bansa ng Diffusion:	Not Available
Bansang Pinagmulan:	US
Dinesenyo para sa:	Processors, Server S-RAMs, Mass Storage Drives, Wireline/Wireless Hardware, Notebooks, BGA, Power Conversion
Uri ng Produkto:	Thermal Interface Products
Laki:	8 in x 16 in
Dami ng Pack ng Pabrika:	1
Subcategory:	Thermal Management
Pangalang pangkalakal:	GAP PAD
Mga Alias ng # ng Piyesa :	L8INW16INH0.06 BG417321 L8INW16INH0D0 2166354
Timbang ng Unit:	417 g

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CNHTS:: 3824999999
CAHTS:: 8541900000
USHTS:: 3919905060
JPHTS:: 8542900006
KRHTS:: 3919900000
TARIC:: 8541900000
MXHTS:: 3919909900
ECCN:: EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD®

Bergquist TGP 3000 3W/m-K, Reinforced Soft S-Class GAP PAD® features a thermal conductivity of 3W/m-K, providing exceptional thermal performance at low pressures. The material is supplied with protective liners on both sides, which have naturally inherent tack. TGP 3000 GAP PAD from Bergquist is ideal for high-performance, low-stress applications that would typically use fixed standoff or clip mounting. The conformable, yet elastic material offers excellent interfacing and wet-out characteristics.