53254 Serye Mga Header at Wire Housing

Mga Resulta: 14
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 Mfr.
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Dami RoHS ECAD Model Produkto
Uri
Dami ng Posisyon
Pitch
Dami ng Row
Isitilo ng Mounting
Istilo ng Termination
Anggulo ng Mounting
Gender ng Contact
Plating ng Contact
Haba ng Mating Post
Termination Post Length
Series
Pangalang pangkalakal
Application
Minimum na Operating Temperature
Maximum na Operating Temperature
Packaging
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 12Ckt
Datasheet
6,506May Stock
Min.: 1
Mult.: 1

Headers Shrouded 12 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 11Ckt
Datasheet
15,098May Stock
Min.: 1
Mult.: 1

Headers Shrouded 11 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 15Ckt
Datasheet
2,374May Stock
Min.: 1
Mult.: 1

Headers Shrouded 15 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2.0 WtB Wafer Assy RA 2Ckt
Datasheet
47,653May Stock
24,000Inoorder
Min.: 1
Mult.: 1

Headers Shrouded 2 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 3CKT WTB R/A
Datasheet
12,303May Stock
Min.: 1
Mult.: 1

Headers Shrouded 3 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 4CKT WTB R/A
Datasheet
13,295May Stock
Min.: 1
Mult.: 1

Headers Shrouded 4 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 6CKT WTB RA 3 SIDED SHROUD
Datasheet
18,321May Stock
Min.: 1
Mult.: 1

Headers Shrouded 6 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As B Wafer Assy RA 7Ck
Datasheet
12,066May Stock
Min.: 1
Mult.: 1

Headers Shrouded 7 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2mm MicroLatch RA HDR 5CKT Square Pin
Datasheet
9,534May Stock
15,988Inoorder
Min.: 1
Mult.: 1

Headers Shrouded 5 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 8CKT WTB R/A
Datasheet
6,555May Stock
Min.: 1
Mult.: 1

Headers Shrouded 8 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings W-T-B HDR R/A 9P
Datasheet
849May Stock
Min.: 1
Mult.: 1

Headers Shrouded 9 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 10Ckt
Datasheet
5,194May Stock
Available ang Higit Pang Impormasyon
Min.: 1
Mult.: 1

Headers Shrouded 10 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2MM MICROLTCH HDR RA 13CKT SQ PIN
Datasheet
1,245May Stock
Min.: 1
Mult.: 1

Headers Shrouded 13 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 14Ckt
Datasheet
1,863May Stock
Min.: 1
Mult.: 1

Headers Shrouded 14 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray